0.8 °C/W, 550 volts/mil, 21.7 kV/mm
Key Features
- Suitable for CPU, chipsets on Mainboard, VGA card, etc
- Easy to use
- Zif Socket Templates ensure correct applying area with various CPU socket types
- Produces an even layer when using applicator
- Dielectric
- Wide range of application temperature
Description
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
Specifications
| Features |
|---|
| Type |
Thermal paste |
| Thermal resistance |
0.8 °C/W |
| Thermal conductivity |
4.5 W/m·K |
| Product colour |
White |
| Specific gravity |
2.37 g/cm³ |
| Packaging data |
|---|
| Package width |
102 mm |
| Package depth |
171 mm |
| Package height |
40 mm |
| Quantity per pack |
1 pc(s) |
| Technical details |
|---|
| Thermal resistance |
0.8 °C/W |
| Thermal conductivity |
4.5 W/m·K |
| Weight & dimensions |
|---|
| Package width |
102 mm |
| Package depth |
171 mm |
| Package height |
40 mm |
| Colour |
|---|
| Product colour |
White |
| Logistics data |
|---|
| Quantity per pack |
1 pc(s) |
