Gembird TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 24 g

Heatsink silicone thermal paste grease, 15 g

Key Features

• Keep your computer's CPU cool
• Practical bottle of increased volume

Description

Thermal silicone compound (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive

Specifications

Features
Type	Thermal paste
Density	3.15 g/cm³
Constitutive ingredients	Silicone
Silicone percentage	15%
Carbon percentage	35%
Thermal resistance	0.0087 °C/W
Viscosity note	12500 Pa s
Thermal conductivity	4.63 W/m·K
Operating temperature (T-T)	-30 - 280 °C
Product colour	Grey
Certification	RoHS, CE
Weight & dimensions
Width	30 mm
Depth	35 mm
Height	30 mm
Weight	24 g
Package width	30 mm
Package depth	35 mm
Package height	30 mm
Package weight	30 g
Packaging data
Package width	30 mm
Package depth	35 mm
Package height	30 mm
Package weight	30 g
Quantity per pack	400 pc(s)
Technical details
Density	3.15 g/cm³
Constitutive ingredients	Silicone
Silicone percentage	15%
Carbon percentage	35%
Thermal resistance	0.0087 °C/W
Viscosity note	12500 Pa s
Thermal conductivity	4.63 W/m·K
Operating temperature (T-T)	-30 - 280 °C
Certification	RoHS, CE
Operational conditions
Operating temperature (T-T)	-30 - 280 °C
Colour
Product colour	Grey
Logistics data
Country of origin	China
Quantity per pack	400 pc(s)