Description
StarTech 20g Tube CPU Thermal Paste Grease Compound for Heatsinks - heat grease - cpu paste - thermal compound (HEATGREASE20)
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20.
Key Features
- Ceramic-based compound containing silicone
- Thermal conductivity of more than 1.066 W/m-K
Description
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone CompoundThe HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20.
Specifications
| Features | |
|---|---|
| Storage temperature (T-T) | -50 - 100 °C |
| Operating relative humidity (H-H) | 10 - 80% |
| Thermal resistance | 0.195 °C/W |
| Thermal conductivity | 1.066 W/m·K |
| Operating temperature (T-T) | -20 - 100 °C |
| Product colour | White |
| Specific gravity | 2.3 g/cm³ |
| Technical details | |
| Evaporation (@ 200°C/24h) | 0.001% |
| Bleed (@ 200°C/24h) | 0.005% |
| Compliance certificates | RoHS |
| Storage temperature (T-T) | -50 - 100 °C |
| Operating relative humidity (H-H) | 10 - 80% |
| Thermal resistance | 0.195 °C/W |
| Thermal conductivity | 1.066 W/m·K |
| Operating temperature (T-T) | -20 - 100 °C |
| Weight & dimensions | |
| Width | 72 mm |
| Depth | 18 mm |
| Height | 18 mm |
| Weight | 24 g |
| Package width | 79 mm |
| Package depth | 147 mm |
| Package height | 21 mm |
| Package weight | 37 g |
| Packaging data | |
| Package width | 79 mm |
| Package depth | 147 mm |
| Package height | 21 mm |
| Package weight | 37 g |
| Operational conditions | |
| Storage temperature (T-T) | -50 - 100 °C |
| Operating temperature (T-T) | -20 - 100 °C |
| Colour | |
| Product colour | White |
| Logistics data | |
| Products per master (outer) case | 230 pc(s) |
| Master (outer) case width | 434 mm |
| Master (outer) case length | 345 mm |
| Master (outer) case height | 349 mm |